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Search Results for forced-convection

Article
Force Convection Heat transfer from a Different Cross Section Cylinder Embedded in Porous Media

Suhad A. Rasheed, Jasim M. Abood

Pages: 727-736

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Abstract

This research presents an experimental study of forced convection heat transfer for laminar steady flows in a duct filled with saturated porous media glass balls.The heater model consists of a circular cylinder , square cylinder and triangular cylinder .The experimental work was studied the effect of changing heater section on forced convection heat transfer with selected values of heat supply ( 2455W/m2 ).The experiments were carried out for Reynolds number ( 1094 ?

Article
The Porosity Effect of Stainless Steel Balls on Forced Convection Pipe Flow

Ayser Munner Flayh, Sajida Lafta Ghashim

Pages: 102-108

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Abstract

An experimental study has been carried out to investigate the effects of stainless-steel balls on forced convection flow in pipe under uniform heat flux. Water is used as the working fluid and stainless-steel balls as a porous media. The Reynolds number range from (5000 to 9000) based on the diameter of the pipe. The experiments were conducted on three various numbers of stainless-steel balls (N) with various diameters (dp), which give various porosity (0.33, 0.38 and 0.41). These are (N= 2400, dp=1mm), (N=1600, dp=3mm) and (N= 750, dp=5mm). Results show that, heat transfer coefficient increases with the decrease in the porosity due to the reduction in the space between balls. This led to an increase in turbulence and produced eddies. Furthermore, enhancement in heat transfer coefficient reached its maximum value of (45%) for ball diameter with (dp=1mm) and water flow rate (9 L/min). New Correlation equations for the average heat transfer coefficient were obtained for three different diameters of balls (1, 3 and 5 mm).

Article
Experimental Investigation of Forced Convection Heat Transfer in Open Cell Copper Fins

Issam Mohammed Ali, Munther Abdullah Mussa, Mustafa Mahdi Mustafa

Pages: 272-280

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Abstract

Recently, major part of convection heat transfer researches focus on increasing fins efficiency by increasing thermal performance for the same fin volume. Metal foam is a promising way to achieve this aim. Performance analysis has been carried out to investigate the heat transfer characteristics of copper fin foam samples. The samples have been compared with the solid metal fin heat transfer. A forced convection heat transfer had been applied to a four specimens. An electrical heater heats up the fins, which are subjected to a stream of the ambient air driven by a blower fan as heat dissipated. The heat flux had been fixed along the tests with three different air velocity used; the forced heat convection had been simulated. The pores density of copper fin foam is varied in the range of 10, 20 & 40 pores per inches (PPI). Thermal performance of copper fin foam has been evaluated in terms of average Nusselt number and thermal resistance of heat sinks. The increasing in the heat transfer rate and average Nusselt number when used metal foam has been found in the range of 36-133 % compare to solid copper. Furthermore, it has been proven that this increment reaches the maximum value for a given PPI even when raise the air velocity.

Article
Thermal Performance Enhancement of Phase Change Materials (PCMs) by Using Metal Foams

Ihsan Y. Hussain, Marwah Abdulkareem Jasim

Pages: 235-249

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Abstract

An investigation of thermal conductivity enhancement, melting and solidification processes of Phase Change Materials (PCMs) by using metal foams has been carried out. Two models have been used in the experiments, model I for measuring the effective thermal conductivity of metal foam embedded in paraffin wax, and model II used as a small scale thermal energy storage device with and without metal foam for investigating melting and solidification processes of the PCM under different cooling conditions (natural and forced convection). The theoretical investigation involves analytical solution of two models, the semi-infinite medium for calculating the thermal conductivity, and the thermal energy storage system TESS has been analyzed including several assumptions for determining the convective heat transfer coefficient and the factors that controlling forced convection and solidification of the PCM. The experimental results show that the thermal conductivity of wax with 10 PPI metal foam increased by (37-39) times that of pure wax. Effects of pore density (10 and 40 PPI), metal foam, and mass flow rate on solidification process have been studied and the effects of pore density and metal foam on the melting process have also been investigated. The present experimental results have been compared with the available previous studies and gave a good agreement.

Article
Numerical and Experimental Study of CPU Cooling with Finned Heat Sink and Different P.C. Air Passages Configurations

Jalal M. Jalil, Ekbal H. Ali, Hiba H. Kurdi

Pages: 99-107

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Abstract

This study investigated numerically and experimentally fluid flow and heat transfer in the desktop PC. Three patterns of the positions of air inlet and outlet were tested to find the best one for cooling. The computer components in the present study are CPU, finned heat sink, power supply, motherboard, CD, HDD and fans. Three components which were generate heat are CPU, motherboard and power supply and there were two openings for air inlet and two for air outlet. The air inlet velocities were 1.2, 1.8, 2.4 m/s with constant CPU fan velocity. The studied parameters were the changed of inlet air velocity, powers of CPU, motherboard and PSU and the positions of inlet air. The numerical results obtained are found in a good agreement with the experimental results. The experimental results show that the maximum temperature was 81  at 16.5 W and 1.2 m/s. Numerical results showed that the CPU temperature reaches 89.6  at 18.5 W and 1.2 m/s. From the results, it was found that; the temperatures of the main components (PSU and motherboard) affected little by CPU power and vice versa, the finned heat sink has higher cooling efficiency and the pattern 1 was the best pattern for CPU cooling.

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