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Search Results for current-density

Article
Porous Silicon Refractive Index Measurements with the Assistance of Two types of Lasers

Saad A. Mohammed Salih

Pages: 1034-1039

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Abstract

Porous Silicon (PSi) samples with (100) orientation n-type were prepared by photo-electrochemical etching process for different variable parameters and fixed electrolyte solution HF:C2H5OH:H2O (2:3:3). Physical and optical properties of PSi would be varied with the variation of process parameters such as current density, anodization time and laser wavelengths. Two types of 50 mW diode lasers were chosen, 473 nm Blue & 532 nm green at 20 mA/cm2 & 15 min etching time to assist the iodization process.  The band gap of the fabricated layer has raised up to (2.9 eV) which is more than twice its original value for the c-Si (1.12 eV). _x000D_ Exploiting the obtained gap energy values, the refractive index of porous silicon layer was calculated depending upon Vandamme empirical relation. It was observed that the porosity is modifiable through etching conditions, which in turn makes refractive index also modifiable. Thus, the calculation depended on taking certain parameters as the current density and etching time in order to compare the effect of applying the two laser wavelengths. AFM was applied to observe the homogeneity and roughness of the PSi mono-layer. The results are in a very good agreement with the range of the refractive indices of PSi and the illumination with green laser gives a better conclusion to use in solar cells as a good absorber and a bad reflector.

Article
Corrosion Behavior of Diffusion Bonding Joints of (OFHC) Copper with Stainless Steel 304L in 3.5% NaCl

Sami Abualnoun Ajeel, Ahmed Ali Akbar Akbar, Safaa Mohammed Hassoni

Pages: 74-81

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Abstract

The present work deals with direct diffusion bonding welding without interlayer of austenitic stainless steel type AISI 304L with Oxygen Free High Conductivity pure copper (OFHC) in vacuum atmosphere (1.5 *10-5 mbr.). The optimum bonding conditions are temperature of 650 ?C, duration time of 45 min. and the applied stress of 30 MPa, in order to secure a tight contact between the mating surfaces. The corrosion behavior of diffusion bonding joints in 3.5% Nacl is studied to evaluate the corrosion resistance of welding joints by using Potentiodynamic method. The observed microstructure of corroded specimen of optimum diffusion bonding joint shows that the corrosion current density has low value as compared with base materials used. During polarization, galvanic coupling is observed between two materials used. At passivity region, inverse polarity is occurred at 450mV. Therefore, passive stainless steel 304 L behaves as cathode respective to pure copper, the corrosion behavior of the diffusion bonding joint was mostly by copper side. The corrosion results indicate the presence of galvanic effect. The corrosion current density of copper, stainless steel 304L and bond joints condition were (3.66 µA/cm2, 1.62 µA/cm2 and 1.85µA/cm2) respectively. A SEM examination of corroded diffusion bonding joint indicates that the galvanic corrosion happened on copper side. The corrosion rate of bonding joint conditions was 0.85 mpy, which is less than 1%. This means that corrosion resistance of bond joint is more than excellent.

Article
Study the Effect of Electrodeposition Parameters on Ni/SiC Composite Coating

Fatima N. Jaseem, Mofeed A.L. Jaleel

Pages: 1005-1011

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Abstract

In this research, we successfully obtained Ni/SiC micro-composite coatings with various contents of SiC particles of particle size(10 ?m), by using electrodeposition method from nickel watts bath in which the SiC particles suspend. The effects of the current density, temperature, and particle loading(PL) of SiC particles in the electrolyte on the morphology, texture, and vol% of SiC in deposit were investigated. The morphological and structural analysis show uniform distribution of SiC particles within the composite coatings. It was found that the depositing conditions affect the microstructure of deposited nickel and the SiC vol% in deposit. Furthermore, the vol% of SiC increases in deposit by increasing the particle loading(PL) in the bath, while decreased by increasing the current density. Also the higher values of SiC vol% were obtained at temperature (50°C).

Article
The Microstructure Properties of Ni-W Alloy Electrodeposition

Mofeed A. Jaleel, Eilaf Z. Gurji

Pages: 82-85

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Abstract

The Electrodeposition process has been used to prepare Nickel-Tungsten alloys on low carbon steel substrate by using ammonical citrate bath. The influence of deposition condition by variation of current density (0.04-0.2 A/cm2) and solution temperature (60-70 °C), on the microstructure was studied. The optical microscope and the scanning electron microscopy (SEM) were used to study the morphology of the deposit while the energy dispersive spectroscopy (EDS) was used to approximate the composition, in addition to X-Ray diffraction examination. The results show that the current efficiency has the major influence on the tungsten content in the alloys due to the formation of ternary complex which reflected into the properties of the deposit._x000D_ Keywords: 

Article
Improvement Silicon Nanostructured Surface by Laser Induced Etching Process

Marwa Hikmat Ibrahim, Bassam G. Rasheed

Pages: 323-328

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Abstract

Surface reconstruction of silicon using lasers could be utilized to produce silicon nanostructures of various features. Electrochemical and photoelectrochemical etching processes of silicon were employed to synthesize nanostructured surface. Effects of current densities 5, 10 and 20 mA/cm2 on the surface features were examined. It is found that the surface porosity and layer thickness increase with the current density. Moreover, large surface area of 410 m2/cm3 can be achieved when laser power density 0f 0.6 W/cm2 was used during the etching process. Optimum operating conditions were found to achieve better silicon nanostructured surface features. The surface roughness can be reduced to 8.3 nm using laser beam of 650 nm irradiated the silicon surface during the photoelectrochemical etching process. The surface morphology of the nanostructured silicon surface using SEM and AFM could give rich details about the surface. Silver nanoparticles of 10 – 20 nm was embedded at the nanostructured silicon surface by LIFT process to reduce the surface resistance and maintain the large surface area. This technique enables silicon nanostructures to be efficiently used in many optoelectronic applications.

Article
Effect of Aging on Corrosion Behavior of Martensite Phase in Cu-Al-Be Shape Memory Alloy

Jafer T. Al-Haidary, Ali M. Aldulaimi, Ahmed A. Hamza

Pages: 127-132

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Abstract

The corrosion behavior of martensite phase in Cu-Al-Be shape memory alloy with aging at 150  at time 2,4and 6 hour and quenching ice water with salt, water at room temperature and oil media study by open circuit potential, tafal polarization and cyclic polarization. The microstructure of martensite study by optical microscope and x-ray diffraction(XRD) and transformation temperature was determined by Di?erential Scanning Calorimeter (DSC).the result show aging martensite at 150   at 2 and 4 hour have high open circuit potential, low corrosion current density , high corrosion potential and pitting potential than  martensite without aging.

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