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Go to Editorial ManagerThe sun is an inexhaustible source of clean energy. For a long time, humans perceived the sun as a source of heat and light, without thinking of using it fully for their purposes. The worldwide solar photovoltaic (PV) market has been growing rapidly, with significant investments leading to increased capacity. Mathematical models are used to calculate solar radiation, taking into account various meteorological factors to predict solar energy generation. The construction of P-V curves helps understand the output of PV systems, crucial for optimizing energy conversion efficiency. The photovoltaic effect allows solar cells to convert light into electrical energy, highlighting the importance of understanding the relationship between current and voltage in solar panels. In this work, the mathematical model of PV is presented and the equations that describe the relation between PV and environment are presented. Finally, a complete model is designed in Matlab and the results are presented.
This study investigated numerically and experimentally fluid flow and heat transfer in the desktop PC. Three patterns of the positions of air inlet and outlet were tested to find the best one for cooling. The computer components in the present study are CPU, finned heat sink, power supply, motherboard, CD, HDD and fans. Three components which were generate heat are CPU, motherboard and power supply and there were two openings for air inlet and two for air outlet. The air inlet velocities were 1.2, 1.8, 2.4 m/s with constant CPU fan velocity. The studied parameters were the changed of inlet air velocity, powers of CPU, motherboard and PSU and the positions of inlet air. The numerical results obtained are found in a good agreement with the experimental results. The experimental results show that the maximum temperature was 81 at 16.5 W and 1.2 m/s. Numerical results showed that the CPU temperature reaches 89.6 at 18.5 W and 1.2 m/s. From the results, it was found that; the temperatures of the main components (PSU and motherboard) affected little by CPU power and vice versa, the finned heat sink has higher cooling efficiency and the pattern 1 was the best pattern for CPU cooling.